CMP slurry solution for hardened fluid material

ABSTRACT

A slurry solution for a Chemical Mechanical Polishing (CMP) process includes a wetting agent, a stripper additive that comprises at least one of: N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, and dimethylformamide (DMF), and an oxidizer additive comprising at least one of: hydrogen peroxide (H2O2), ammonium persulfate ((NH4)2S2O8), peroxymonosulfuric acid (H2SO5), ozone (O3) in de-ionized water, and sulfuric acid (H2SO4).

PRIORITY INFORMATION

This application is a divisional of U.S. patent application Ser. No. 14/261,644 filed Apr. 25, 2014, and entitled “CMP Slurry Solution for Hardened Fluid Material,” the disclosure of which is hereby incorporated by reference in its entirety.

BACKGROUND

Integrated circuits may be formed using various photolithographic techniques. Such techniques typically include use of a Chemical Mechanical Polishing (CMP) process. The CMP process is typically used to grind down and smooth the surface of a semconductor substrate. In some cases, the CMP process is used to remove some or all of previously formed layer(s) that are no longer needed. For example, trenches may be formed into a semiconductor substrate. Various other layers of material may be deposited within the trenches. To simplify the deposition process, these layers are deposited on the entire semiconductor substrate, including the trench areas and non-trench areas. To remove the deposited layers from the non-trench areas, the CMP process may be applied to grind away the deposited layers.

The CMP process uses a slurry solution that includes a chemical solution with a specific viscosity that will hold very small particles. The particles are made of a hard material such as silica (SiO₂) or alumina (Al₂O₃). These particles help grind away and smooth the surface of the substrate. Conventional CMP processes are designed such that the primary mode of grinding is the mechanical aspect, particularly, the particles. The smaller aspect of the process is the chemical process, which involves a chemical reaction to help remove the surface of the substrate. Such CMP processes work well for planarizing harder materials such as the dielectric material of an interlayer dielectric (ILD).

In some cases, it may be desirable to perform a CMP process on a softer material such as a photoresist material or an anti-reflective coating material. Such materials are typically formed by applying the material as a fluid and hardening that fluid through a baking process. But, the CMP process is generally not designed to work effectively on such materials. Particularly, there may be undesired scratching and peeling. Accordingly, it is desirable to have a CMP process that works effectively on softer materials such as hardened fluid materials.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIGS. 1A-1F are diagrams showing an illustrative fabrication process involving a CMP process on a hardened fluid material, in accordance with some embodiments.

FIG. 2 is a diagram showing an illustrative CMP system, in accordance with some embodiments.

FIG. 3 is a diagram showing illustrative components of a CMP slurry solution, in accordance with some embodiments.

FIG. 4 is a diagram showing an illustrative breaking of chemical bonds, in accordance with some embodiments.

FIG. 5 is a flowchart showing an illustrative method for using a CMP process on a hardened fluid material.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90° degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

FIGS. 1A-1F are diagrams showing an illustrative fabrication process 100 involving a CMP process on a hardened fluid material. According to the present example, FIG. 1A illustrates a number of integrated circuit features 104 are formed onto a substrate 106. A hardened fluid material 106 is formed over the features 102.

The integrated circuit fabrication process typically includes forming various features 104 onto a substrate 102. These features 104 may include resistors, capacitors, and transistors. Transistors typically include gate structures. Various photolithographic processes may be used to pattern the features 104. The pattern density may vary throughout the pattern. Additionally, different features 104 may be at different heights after the various fabrication processes used to form the features 104 are applied.

In conventional semiconductor fabrication, features 104 formed on a substrate are covered with a dielectric material, often referred to as an interlayer dielectric (ILD). A CMP process is then formed on the ILD to make it flat for the next layer to be formed on top. But, because of the size differences and pattern density differences, it is difficult to create a completely flat surface, even with a good CMP process. Moreover, the higher features cannot simply be etched to have a reduced height. Such etching processes may damage the underlying substrate 102.

According to the present example, to resolve this issue, a fluid material is applied to cover the feature. The fluid material may be applied through a spin coating process. A hardening process, such as a baking process, is then used to solidify the fluid material. Thus, the material is referred to as a hardened fluid material 106.

In some examples, the hardened fluid material 106 is an organic material such as a photoresist material. Because the photoresist material is not being used for photolithographic purposes in this case, it does not have to have a photosensitive component such as a photo acid generator (PAG).

In some examples, the hardened fluid material 106 may be an anti-reflective coating (ARC) material. Such material is often used in association with a photoresist to aid the exposure process. Because the ARC material is usually below the photoresist layer, it is sometimes referred to as bottom anti-reflective coating (BARC).

FIG. 1B is a diagram showing an illustrative CMP process 108 performed on top of the hardened fluid material 106. CMP processes are typically designed for harder materials such as an ILD. These processes rely more on the mechanical aspect of polishing and less on the chemical aspect. Because the hardened fluid material 106 is generally a softer material, a standard CMP process may cause scratching and peeling of the surface. This can have adverse effects on subsequent processes.

Accordingly, the CMP process 108 may be tuned for use with a hardened fluid material 106. Such tuning may involve the use of oxidizers and other additives that break down the surface of the hardened fluid material 106 and make it easier to remove and less prone to scratching and peeling. The tuned CMP process will be discussed in further detail below.

FIG. 1C is a diagram showing an illustrative etching process 110 to reduce the height of some of the features so that they are more even. Because the hardened fluid material 106 is in place, the etching process 110 does not damage the substrate 102. Thus, the etching process 110 can be designed to effectively even the height of the features 104 without concern for damaging the substrate 102.

FIG. 1D is a diagram showing an illustrative hard mask removal process 112. In some examples, the top of the features 104 may include remnants of a hard mask material (not shown) used in the patterning process used to form the features. The hard mask removal process 112 thus removes that hard mask material.

FIG. 1E is a diagram showing an illustrative hardened fluid removal process 114. The hardened fluid material 106 may be used as a temporary layer to protect the substrate. When it is no longer needed, after the etching process is performed, it can be removed. In one example, the hardened fluid material 106 is removed by an ashing process.

FIG. 1F is a diagram showing an illustrative ILD layer 114. Because the heights of the features 104 are more even in light of the above described process, the ILD layer can be planarized using a standard CMP process and result in a flatter surface. Thus, subsequent layers formed onto the ILD are less affected by non-uniformities in the ILD surface.

FIG. 2 is a diagram showing an illustrative CMP system 200. According to the present example, the system 200 includes a polishing pad 204 on a platen 202, a wafer 206 secured to a polishing head 208, and a slurry solution delivery tool 210 to deliver a tuned CMP slurry solution 212.

The platen 202 is a very flat structure designed to hold the polishing pad. In some examples, the platen is a circular shape when viewed from the top. Additionally, the platen 202 may be designed to rotate around a central axis. The polishing pad is designed to be pressed directly to the surface of a wafer 206 being polished. The polishing pad 204 provides a very flat surface and is made of a material designed for use with the CMP process.

A semiconductor wafer 206 is typically secured upside down to the polishing head 208. In some examples, a vacuum system is used to secure the wafer 206 to the polishing head 208. The polishing head is thus sometimes referred to as a chuck. The polishing head 208 may include a retaining ring (not shown) to keep the wafer 206 in position and prevent it from moving horizontally with respect to the polishing head 208. The polishing head 208 may be designed to move across the surface of the polishing pad to rub the wafer 206 against the polishing pad 204.

The slurry solution tool 210 delivers a slurry solution 212 to the surface of the polishing pad. In this example, the slurry solution is tuned for the specific purpose of performing a CMP process on a hardened fluid material. Thus, the slurry solution has various properties that allow the slurry solution to better planarize the softer hardened fluid surface.

FIG. 3 is a diagram showing illustrative components of a CMP slurry solution 302. According to the present example, the slurry solution 302 includes at least a stripper additive 304, and oxidizer additive 306, and a non-spherical abrasive 308. The slurry solution 302 may include other components as well.

According to one example, the slurry solution may include a stripper additive 304 to help strip the surface of the hardened fluid material. The hardened fluid material is typically an organic material. Thus, the stripper additive 304 can be designed to breakdown organic material. Specifically, the stripper additive can be designed to break the carbon-oxygen bonds or the carbon-carbon bonds of the hardened fluid material.

The stripper additive may include a variety of materials. For example, the stripper additive 304 may include N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, or dimethylformamide (DMF). Such materials will allow for better surface penetration and dissolution of the hardened fluid material.

The oxidizer additive 306 may also be used to aid and fine tune the CMP process for use with the hardened fluid material. Specifically, the oxidizer additive 306 may be used to help oxidize, soften, and dissolve the surface of the hardened fluid material to reduce friction during the polishing process. Additionally, the oxidizer can inhibit surface stress that can cause peeling.

The oxidizer additive may comprise a number of different materials. For example, the oxidizer may comprise a combination of hydrogen peroxide (H₂O₂) and sulfuric acid (H₂SO₄). The ratio between hydrogen peroxide and sulfuric acid may be within a range of about 1:1 and 1:10. In some examples, a persulfate compound may be used such as ammonium persulfate (NH₄)₂S₂O₈. Other materials may be used as well. For example, de-ionized water with O₃ may be used or peroxymonosulfuric acid (H₂SO₅).

The following table shows various other oxidizers that may be used as well as how they react with organic compounds, such as the hardened fluid material.

TABLE 1 Oxidizer General Reaction with Organic Compounds H₂O₂ —CH₂— + 3 H₂O₂ −> 4 H₂O + CO₂ H₂SO₅ —CH₂— + 3 H₂SO₅ −> 3 H₂SO₄ + CO₂ + H₂0 O₃ —CH₂— + 3 O₃ −> 3 O₂ + CO₂ + H₂O S₂O₈ —CH₂— + 3 S₂O₈ + 2 H₂O −> 6 HSO₄ + CO₂

The slurry solution 302 may also include non-spherical abrasive particles. As described above, a CMP slurry solution is often a viscous solution so that particles can be suspended. The particles are typically spherical in order to provide a smoother surface on the final polished surface. But, because of the softer nature of the hardened fluid surface, the spherical particles are not necessarily beneficial. Thus, non-spherical abrasives may be used. Non-spherical abrasives can increase the mechanical efficiency of the CMP process.

The slurry solution 302 may include a number of other components. For example, the slurry solution 302 may include a wetting agent or surfactant. A wetting agent is a compound that has a molecular structure with both a hydrophobic end and a hydrophilic end. Thus, such materials reduce the surface tension of the slurry solution and provide better contact between the polishing head and the surface of the wafer being polished.

In some examples, the slurry solution may also include an acid catalyst. The acid catalyst may enhance the surface oxidation of the hardened fluid material. Additionally, the acid catalyst may help the hydrolysis reaction that occurs during the CMP process of the hardened fluid material.

In conventional CMP processes, the pH level may be adjusted for various purposes and may range from 2 to 11, for example. In the case of the CMP slurry solution embodying principles described herein, the pH level may be less than seven. Thus, the slurry solution will tend to be a basic solution rather than an acidic solution.

FIG. 4 is a diagram showing an illustrative breaking of carbon-oxygen bonds. FIG. 4 illustrates the chemical bonds of an example hardened fluid. The hardened fluid may include bonds between Carbon (represented by a C), Oxygen (represented by an O), and Nitrogen (represented by an N). FIG. 4 also illustrates breaking 402, 404 of the carbon-oxygen bonds within the hardened fluid material. This helps dissolve or soften the surface of the hardened fluid material and helps with the CMP process.

FIG. 5 is a flowchart showing an illustrative method for using a CMP process on a hardened fluid material. According to the present example, the method 500 includes a step 502 for applying a fluid material over a patterned substrate. As described above, the fluid material may be a photoresist material or an anti-reflective coating material. A photoresist material may not have a photosensitive component such as a PAG because it is not being used for photolithographic purposes. The fluid material may be any other type of material that is capable of being applied as a fluid and hardened into a solid material.

According to the present example, the method 500 includes a step 504 for hardening the fluid material to form a hardened material. The hardening step may be done through a baking process. The hardening step may also involve cross linking. Because of the uneven nature of features on the patterned substrate, the top surface of the hardened fluid will not be very flat. Thus, it is desirable to planarize the surface using a CMP process.

According to the present example, the method 500 includes a step 506 for performing a Chemical Mechanical Polishing (CMP) process to a surface of the hardened fluid, the CMP process comprising use of a slurry solution that includes an additive to change a bonding structure on the surface of the hardened fluid material. Specifically, the additive may break the carbon-carbon bonds or carbon-oxygen bonds of the hardened fluid material.

The additive may include a stripper additive that includes a material such as N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, or dimethylformamide (DMF). The additive may also include an oxidizer such as hydrogen peroxide (H₂O₂), ammonium persulfate ((NH₄)₂S₂O₈), peroxymonosulfuric acid (H₂SO₅), ozone (O₃) in de-ionized water, and sulfuric acid (H₂SO₄). The additive may also include non-spherical abrasives. In some examples, the pH level of the slurry solution is kept below 7. The slurry solution may include other components such as a wetting agent or surfactant.

According to certain illustrative examples, the method 500 further includes a step 508 for polishing the surface of the hardened fluid material with a polishing head. The polishing head may secure the semiconductor wafer thereto using a vacuum process. The polishing head may then press the wafer up to a polishing pad on which the slurry solution has been applied by a slurry delivery tool. The polishing head may then move the wafer with respect to the polishing pad to perform the CMP process.

According to one embodiment, a method for performing a Chemical Mechanical Polishing (CMP) process includes applying a CMP slurry solution to a surface of a hardened fluid material on a substrate, the solution comprising an additive to change a bonding structure on the surface of the hardened fluid material. The method further includes polishing the surface of the hardened fluid material with a polishing head.

According to one embodiment, a method includes applying a fluid material over a patterned substrate, hardening the fluid material to form a hardened fluid material, performing a Chemical Mechanical Polishing (CMP) process to a surface of the hardened fluid, the CMP process comprising use of a slurry solution that includes an additive, to change a bonding structure on the surface of the hardened fluid material.

According to one embodiment, a slurry solution for a Chemical Mechanical Polishing (CMP) process includes an organic solvent, a wetting agent, a stripper additive that comprises at least one of: N-Methyl-2-pyrrolidone (NMP), Dimethyl Sulfoxide (DMSO), Sulfolate, dimethylformamide (DMF), and an oxidizer additive comprising hydrogen peroxide (H₂O₂) and sulfuric acid (H₂SO₄).

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure. 

What is claimed is:
 1. A chemical mechanical polishing (CMP) slurry solution for planarizing a photoacid generator free (PAG-free) photoresist layer, the CMP slurry solution comprising: a CMP wetting agent, a CMP stripper additive, and a CMP oxidizer additive configured to break carbon-oxygen bonds, carbon-carbon bonds, or both at a surface of the PAG-free photoresist layer, such that the PAG-free photoresist layer is planarized without removing the PAG-free photoresist layer during a CMP process, wherein oxygen of the carbon-oxygen bonds is further bonded to nitrogen, and further wherein: the CMP stripper additive includes N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, or dimethylformamide (DMF); and the CMP oxidizer additive includes hydrogen peroxide (H₂O₂) and sulfuric acid (H₂SO₄) or ozone (O₃) and de-ionized water.
 2. The CMP slurry solution of claim 1, further comprising, non-spherical abrasive particles suspended within the CMP slurry solution.
 3. The CMP slurry solution of claim 1, wherein a pH level of the CMP slurry solution is less than seven.
 4. The CMP slurry solution of claim 1, wherein the CMP stripper additive is N-methyl-2-pyrrolidone (NMP).
 5. The CMP slurry solution of claim 1, wherein the CMP stripper additive is dimethyl sulfoxide (DMSO).
 6. The CMP slurry solution of claim 1, wherein the CMP stripper additive is sulfolane.
 7. The CMP slurry solution of claim 1, wherein the CMP stripper additive is dimethylformamide (DMF).
 8. The CMP slurry solution of claim 1, wherein the CMP oxidizer additive is hydrogen peroxide (H₂O₂) and sulfuric acid (H₂SO₄).
 9. The CMP slurry solution of claim 8, wherein a ratio of H₂O₂ to H₂SO₄ is about 1:1 to about 1:10.
 10. The CMP slurry solution of claim 1, wherein the CMP wetting agent has a molecular structure having a hydrophobic end and a hydrophilic end.
 11. The CMP slurry solution of claim 1, wherein the CMP oxidizer additive is ozone (O₃) and de-ionized water.
 12. The CMP slurry solution of claim 1, wherein the CMP slurry solution further includes an acid catalyst.
 13. A Chemical Mechanical Polishing (CMP) slurry solution for flattening a photoresist layer that includes nitrogen-oxygen-carbon bonds, such that oxygen is directly bonded to nitrogen and carbon in the nitrogen-oxygen-carbon bonds, the CMP slurry solution comprising: a CMP additive configured to break carbon-oxygen bonds of the nitrogen-oxygen-carbon bonds of the photoresist layer, such that the photoresist layer is planarized without removing the photoresist layer during a CMP process, wherein the CMP additive includes a CMP oxidizer additive that includes ozone (O₃) and de-ionized water.
 14. The CMP slurry solution of claim 13, wherein the CMP additive further includes a stripper additive that includes N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, or dimethylformamide (DMF).
 15. The CMP slurry solution of claim 13, further comprising, non-spherical abrasive particles suspended within the CMP slurry solution.
 16. The CMP slurry solution of claim 13, wherein a pH level of the CMP slurry solution is less than seven.
 17. A Chemical Mechanical Polishing (CMP) slurry solution for flattening a photoresist layer that includes nitrogen-oxygen-carbon bonds, such that oxygen is directly bonded to nitrogen and carbon in the nitrogen-oxygen-carbon bonds, the CMP slurry solution comprising: a CMP additive configured to break carbon-oxygen bonds of the nitrogen-oxygen-carbon bonds of the photoresist layer, such that the photoresist layer is planarized without removing the photoresist layer during a CMP process, wherein the CMP additive includes a CMP oxidizer additive that includes hydrogen peroxide (H₂O₂) and sulfuric acid (H₂SO₄).
 18. The CMP slurry solution of claim 17, wherein a ratio of the hydrogen peroxide (H₂O₂) to the sulfuric acid (H₂SO₄) is about 1:1 to about 1:10.
 19. The CMP slurry solution of claim 17, wherein the CMP slurry solution further includes a stripper additive that includes N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, or dimethylformamide (DMF).
 20. The CMP slurry solution of claim 17, wherein a pH level of the CMP slurry solution is about 2 to about
 11. 